SK Hynix CEO says Indiana will be key memory production base by 2030, first U.S. facility now underway

SK Hynix has ceremonially broken ground on its first U.S. advanced packaging facility in West Lafayette, Indiana, a $4 billion investment expected to be operational by October 2028. CEO Kwak Noh-Jung stated the facility will position Indiana as a key High Bandwidth Memory (HBM) production base in America by 2030, bolstering the U.S. semiconductor supply chain. This expansion signifies a significant step in onshoring chip manufacturing processes, with the U.S. government providing substantial CHIPS Act funds and state incentives.

• SK Hynix broke ground on its first U.S. advanced packaging facility in West Lafayette, Indiana, on August 27, 2026.
• The $4 billion facility is designed for chip packaging, where memory chips will be stacked and connected.
• CEO Kwak Noh-Jung aims to make Indiana a key HBM production base in America by 2030.
• The project aims to strengthen the U.S. semiconductor supply chain and contribute to national and economic security.
• The first cleanroom is scheduled to open in October 2028.
• SK Hynix is receiving up to $458 million in federal CHIPS Act funds and up to $712 million in state incentives.
• The facility is expected to create around 1,000 direct jobs and an additional 6,000 related jobs.
• SK Hynix’s total U.S. investments and assets are expected to exceed $45 billion by 2030.
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